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home > 제품소개 > Electro Plating System > Multi Magazine Loading
Multi Magazine Loading
설비 레이아웃 보기
크게 보기
크게 보기
설비spec
도금방식 Sn-Cu, Sn-Bi, Sn-Pb, Pure tin, etc
적용자재 모든 Discrete(TO계열, Fpak IDF pkg, SOT계열,
Power pkg etc), IC, QFN, DFN, Tantalum Condensor,
Auto Motive Device, LED pkg
생산속도 2~6m/min (6m/min)
장비크기 14,000 x 2,600 x 2,260mm(L x W x H)
Loading 방식 - Auto Slot/Stack magazine to Slot/Stack magazine system
- Mechanical gripper and/or vacuum pickup system
- Continuous Belt Conveying System
- High Speed Plating System
- Pitch Loading System (for IDF, Shrink Type pkgs)
도금품질 - Belt 특성: Control 0.6~2mm gap between L/Fs.
- CPK >1.67
- Auto Shield System
정류기 - Constant Current/Constant Voltage control
- IGBT Rectifier(Control 20KHz~25KHz, Ripple 1%)
- 200A~600A
Control 방식 - PLC (LS, Omron, Mitsubishi)
- Touch Screen
- Wireless PC control system
Ring Blower - Jettech standard ring blower
Pump 사양(Optional) - Designed Pressure: Max. 800 kgf/㎠
- Working Pressure: 600 kgf/㎠
- Water Consumption: Max 15L/min
Nozzle(Optional) Diamond Fan Tip Nozzle
Yield 99.98%
MTBA 2 hours
MTBF 168 hours
 
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