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> 제품소개 > Electro Plating System > 2 Stack Magazine Loading
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| 도금방식 | Sn-Cu, Sn-Bi, Sn-Pb, Pure tin, etc |
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| 적용자재 | 모든 Discrete(TO계열, Fpak IDF pkg, SOT계열, Power pkg etc), IC, QFN, DFN, Tantalum Condensor, Auto Motive Device, LED pkg |
| 생산속도 | 2~6m/min (2m/min) |
| 장비크기 | 10,415 x 3,000 x 2,260mm(L x W x H) |
| Loading 방식 | - Auto Slot/Stack magazine to Slot/Stack magazine system - Mechanical gripper and/or vacuum pickup system - Continuous Belt Conveying System - High Speed Plating System - Pitch Loading System (for IDF, Shrink Type pkgs) |
| 도금품질 | - Belt 특성: Control 0.6~2mm gap between L/Fs. - CPK >1.67 - Auto Shield System |
| 정류기 | - Constant Current/Constant Voltage control - IGBT Rectifier(Control 20KHz~25KHz, Ripple 1%) - 200A~600A |
| Control 방식 | - PLC (LS, Omron, Mitsubishi) - Touch Screen - Wireless PC control system |
| Ring Blower | - Jettech standard ring blower |
| Pump 사양(Optional) | - Designed Pressure: Max. 800 kgf/㎠ - Working Pressure: 600 kgf/㎠ - Water Consumption: Max 15L/min |
| Nozzle(Optional) | Semi Permanent Diamond Fan Tip Nozzle |
| Yield | 99.98% |
| MTBA | 2 hours |
| MTBF | 168 hours |
