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home > 기술정보 > Laser Engraving / Sawing
Laser SaWing
Why Laser
1. Narrow Saw Street Width
2. Lots of Metals in Saw Street
3. Low-K/Sapphire Devices
4. Thin Wafer Application
5. GaAs Wafer Application
6. Multi-Die in a Wafer Application
Water Sawing Techiques
Existing wafer Sawing
technologies
Sawing Trend
Laser Sawing/Hybrid Sawing
(CO2 Laser + UV Laser)
Why Laser Engraving
Semiconductor chips for key devices are becoming thinner & soft
Current-generation industrial UV lasers are faster than dicing saws for wafer
Semiconductor chips for key devices
are becoming thinner & soft
Current-generation industrial UV
lasers are faster than dicing saws for
wafer
Saw speeds must be decreased,
leading to low dicing throughput
(Due to chipping, Breaking)
Laser Hole Drilling
Laser Hole Drilling - Holes 사진
 
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