OLB SYSTEM
This facility is a device that vision aligns driving IC (COF) & FPC to the panel and thermally compresses it to drive the panel.
Facility type
COF, FOF, COG, FOG, T-FOG, U-FPC, LASER, SIDE BONDER
PCB BONDING SYSTEM
Automated equipment that attaches and inspects (aligns, indents) the PCB on the supplied panel using a hot bar in an accurate position through each mark recognition
Facility type
PCB, FOB BONDER
MICRO LED FOG BONDING SYSTEM
Automated equipment that inspects the degree of alignment after bonding COF and FPCB to the back of the MICRO LED Glass substrate via ACF
Facility type
FOG BONDER
TEL.
82-41-421-5000